|
序号 |
内容 |
常规 |
特殊 |
|
1 |
层数NO.OF LAYER |
1～7层 |
8-16层 |
|
2 |
完成板尺寸(最大)FINISHED BOARD SIAE (MAX) |
500*1200mm |
OK |
|
3 |
完成板尺寸(最小)FINISHED BOARD SIAE (MIN) |
2mm*2mm |
OK |
|
4 |
软板厚度(最大)BOARD THICKNESS (MAX) |
16 mil (0. 65mm) |
100 mil（2.5mm）软硬结合板 |
|
5 |
软板厚度(最小)BOARD THICKNESS (MIN) |
3 mil (0.075mm)多层板5 mil (0.12mm) |
（防焊）2mil(0.05mm) |
|
6 |
成品厚度公差(0.085mm≦板厚<0. 65mm)FINESHED BOARD THICKNESS FOLERANCE(0.085MM≦BOARD THICKNESS<0.65mm) |
±2mil(±0.05m) |
OK |
|
7 |
钻孔孔径(最大)DRILL HOLE DIAMETER (MAX) |
240 mil (6.0mm) |
260 mil （6.5mm） |
|
8 |
钻孔孔径(最小)DRILL HOLE DIAMETER (MIN) |
4mil (0.1mm) |
OK |
|
9 |
外形精度 |
±4 mil（±0.05mm） |
±2 mil（±0.05mm） |
|
10 |
完成孔径(最小) For machine drillFINESHED VIA DIAMETER (MIN) |
6 mil (0.15mm) |
4 mil （0.10mm） |
|
19 |
孔位公差(与CAD数相比)HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA) |
±2mil(±0.05mm) |
±0.04mm |
|
20 |
PTH孔孔壁铜厚PTH HOLE COPPER THICKNESS |
≧0.4mil(≧10um)≦1.0mil(≦25 um) |
≧7.0um |
|
13 |
绝缘层厚度(最小)INNER LAYER DIELECTRIC THICKNESS (MIN) |
0.0125mm(PI厚1/2mil) |
OK |
|
14 |
绝缘层厚度(最大)INNER LAYER DIELECTRIC THICKNESS (MAX) |
0. 50mm(PI厚2mil) |
OK |
|
15 |
材料类型BASE.MATERIAL |
PI聚酰亚胺/PET聚脂 |
无胶基材 |
|
16 |
孔电镀纵横比(最大)HOLE PLATING ASPECT RATIO (MAX) |
5:01 |
OK |
|
17 |
孔径公差(镀通孔)HOLE DIAMETER TOLERANCE (PTH) |
±2mil(±0.05 mm) |
OK |
|
18 |
钻孔孔径公差(非镀通孔)HOLE DIAMETER TOLERANCG (NPTH) |
±1.5mil(±0.035mm) |
OK |
|
21 |
设计线宽/间距 (最小)LAVER DESIGN LINE WIDTH/SPACING (MIN) |
双面板及多层板1*2OZ 3.5mil/3.5mil(0.08mm/0.08mm) |
特殊：双面板1/4OZ(0.045mm*0.045mm) |
|
单面板1/2OZ 2.5mil/2.5mil(0.06mm*0.06mm) |
|
双面板及多层板1 OZ5mil/5mil(0.12mm*0.12mm) |
|
单面板1 OZ3mil/3mil(0.075mm*0.075mm) |
|
双面板1/3OZ/ 1/4OZ 2mil/2mil(0.05mm*0.05mm) |
|
22 |
蚀刻公差 TOLERANCE AFTER ETCHING |
≦±20%(一般) |
±15%for(impedance) |
|
23 |
图形对图形精度 (最小)IMAGE TO IMAGE TOLERANCE (MIN) |
±4mil(±0.1mm) |
±2mil(0.05mm) |
|
24 |
图形对板边精度(最小)IMAGE TO EDGE TOLERANCE (MIN) |
±4mil(±0.1mm) |
OK |
|
25 |
多层板内层最小PAD |
≧6mil（≧0.15 mm） |
OK |
|
26 |
文字对位精度公差LEGEND MASK REGISTRATION(MIN) |
±12mil(±0.3mm) |
±6mil(±0.15mm) |
|
27 |
防焊对位精度公差SOLDERMASK REGISTRATION(MIN) |
±4mil(±0.1mm) |
±2mil(±0.05mm) |
|
28 |
防焊厚度(最小)SOLDERMASK THICKNESS (MIN) |
0.4mi l(10um) |
OK |
|
29 |
防焊焊盘开窗公差/焊盘与焊盘位置公差 |
±2mil(0.05mm) |
OK |
|
30 |
CVL开窗焊盘公差/焊盘与焊盘公差 |
±4mil(±0.1mm) |
±3mil(±0.076 mm) |
|
31 |
CVL对位精度贴合公差/CVL 最小开方孔REGISTRATION(MIN) |
±4mil (±0.1mm)/ 0.5mm |
±0.1mm |
|
32 |
CVL压合溢胶量(MIN) |
2mil-6mil (0.05-0.15mm) |
OK |
|
33 |
沉镍厚/金厚(最薄点)(最大)NICKEL THICKNESS FOR ELECTROLESS NICKEL AND INMERSION GOLD(MEASLRED AT THE MINTMUM POINT)(MAX) |
0.08-0.12 mil /0.0004-0.003 mil（2-3um/0.01-0.075um） |
OK |
|
34 |
冲孔孔径(min-max),孔径公差,精准度PUNCHING HOLE (MIN-MAX) DIAMETER TOLERANCE |
30-240 mil（0.8-6.0mm）±0.05mm |
OK |
|
45 |
贴合补强板及胶对位公差( THE TOLERANCE OF PASTEING ADHESIVE AND STIFFER) |
±8mil (±0.2um) |
±0.1mm |
|
36 |
冲外形公差(边到边)(钢模)PUNCHING DIE DIMENSION TOLERANCE (EDGE TO EDGE)(STEEL DIE) |
±4mil(±0.1mm)多层板为±6mil(±0.15mm) |
±2mil(±0.05mm) |
|
37 |
冲外形公差(边到边)(刀模)PUNCHING DIMENSION TOLERANCE (EDGE TO EDGE) |
±12mil(±0.3mm) |
±8mil(±0.2mm) |
|
38 |
冲外形公差(简易模)PUNCHING DIMENSION TOLERANCE |
±6mil(±0.15mm) |
OK |
|
39 |
成品板阻抗公差(最小)TMPEDANCE TOLERANCE (MIN) |
±15% |
OK |
